Inventor
Ka Fai Chang
Inventor
Singapore, SG
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
G06FElectric digital data processing17%
H10DInorganic electric semiconductor devices17%
PatentTitleYear
11,018,080Semiconductor package and method of forming the same202110,811,316Method and system of forming integrated circuit202010,720,339Fan-out wafer-level packaging method and the package produced thereof202010,665,550Electromagnetic shielding metal-insulator-metal capacitor structure2020Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2020–2021Patents assigned to AGENCY SCIENCE TECH & RES (2)· patent assignee history
2020Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (2)· patent assignee history
2020–2021Based in Singapore, SG· patent location history
2020Based in Hsinchu, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| AGENCY SCIENCE TECH & RES | 2 | 2020–2021 |
| TAIWAN SEMICONDUCTOR MFG CO LTD | 2 | 2020 |
Locations
| Location | Patents | Span |
|---|---|---|
| Singapore, SG | 2 | 2020–2021 |
| Hsinchu, TW | 2 | 2020 |