Inventor
Jacob Hay
Inventor
Circleville, OH, US
Overview
Patents· 2 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B22Fprimary
B22FWorking metallic powder11%
B29CShaping or joining of plastics11%
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering11%
G01JMeasurement of intensity, velocity, spectral content, polarisation, phase or pulse characteristics of infrared, visible or ultraviolet light11%
G01MTesting static or dynamic balance of machines or structures11%
G06FElectric digital data processing11%
H01SDevices using the process of light amplification by stimulated emission of radiation [laser] to amplify or generate light11%
H04LTransmission of digital information, e.g. telegraphic communication11%
Y02PClimate change mitigation technologies in the production or processing of goods11%
Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2013Patents assigned to HAY JEREMY (1)· patent assignee history
2013Patents assigned to LAU ERIC WAI HO (1)· patent assignee history
2013Patents assigned to MICROSOFT CORP (1)· patent assignee history
2013Patents assigned to WU PETER (1)· patent assignee history
2013Based in Santa Clara, CA, US· patent location history
2021Patents assigned to EDISON WELDING INST INC (1)· patent assignee history
2021Based in Circleville, OH, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| EDISON WELDING INST INC | 1 | 2021 |
| HAY JEREMYself | 1 | 2013 |
| LAU ERIC WAI HO | 1 | 2013 |
| MICROSOFT CORP | 1 | 2013 |
| WU PETER | 1 | 2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Circleville, OH, US | 1 | 2021 |
| Santa Clara, California, US | 1 | 2013 |