Inventor
Takanobu Hotta
Inventor
Nirasaki, JP
Overview
Patents· 9 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C23Cprimary
C23CCoating metallic material22%
H01LSemiconductor devices22%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1022%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1022%
H10DInorganic electric semiconductor devices8%
H10BElectronic memory devices3%
PatentTitleYear
10,872,814Film forming method and film forming apparatus202010,400,330Tungsten film forming method and storage medium201910,131,986Method of forming metal film201810,026,616Method of reducing stress in metal film and metal film forming method20189,938,620Gas supply mechanism, gas supplying method, film forming apparatus and film forming method using the same20189,640,404'Method of forming tungsten film'20179,536,782'Tungsten film forming method, semiconductor device manufacturing method, and storage medium'20179,536,745'Tungsten film forming method'20179,472,454'Tungsten film forming method'2016Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2016–2020Patents assigned to TOKYO ELECTRON LTD (9)· patent assignee history
2016–2019Based in Nirasaki, JP· patent location history
2017–2020Based in Yamanashi, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TOKYO ELECTRON LTD | 9 | 2016–2020 |
Locations
| Location | Patents | Span |
|---|---|---|
| Nirasaki, JP | 6 | 2016–2019 |
| Yamanashi, JP | 3 | 2017–2020 |