Inventor
Rintaro Asai
Inventor
Toyota, JP
Overview
Patents· 3 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices50%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2016–2017Patents assigned to TOYOTA MOTOR CO LTD (2)· patent assignee history
2016Patents assigned to ASAI RINTARO (1)· patent assignee history
2016Patents assigned to TANIDA ATSUSHI (1)· patent assignee history
2016–2017Based in Toyota, JP· patent location history
2020Patents assigned to DENSO CORP (1)· patent assignee history
2020Based in Nisshin, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TOYOTA MOTOR CO LTD | 2 | 2016–2017 |
| ASAI RINTAROself | 1 | 2016 |
| DENSO CORP | 1 | 2020 |
| TANIDA ATSUSHI | 1 | 2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Toyota, JP | 2 | 2016–2017 |
| Nisshin, JP | 1 | 2020 |