Inventor
Reynante Tamunan Alvarado
Inventor
San Diego, CA, US
Overview
Patents· 17 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1055%
H01LSemiconductor devices32%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1010%
B23KSoldering or unsoldering3%
PatentTitleYear
10,163,687System, apparatus, and method for embedding a 3D component with an interconnect structure201810,141,202Semiconductor device comprising mold for top side and sidewall protection20189,985,010System, apparatus, and method for embedding a device in a faceup workpiece20189,806,052'Semiconductor package interconnect'20179,806,048'Planar fan-out wafer level packaging'20179,425,160'Wafer-level package device with solder bump reinforcement'20169,379,065'Crack stopping structure in wafer level packaging (WLP)'20169,209,110'Integrated device comprising wires as vias in an encapsulation layer'20159,171,782'Stacked redistribution layers on die'20159,159,684'Wafer-level packaged device having self-assembled resilient leads'20158,692,367'Wafer-level packaged device having self-assembled resilient leads'20148,686,560'Wafer-level chip-scale package device having bump assemblies configured to mitigate failures due to stress'20148,446,019'Solder bump interconnect'20138,278,748'Wafer-level packaged device having self-assembled resilient leads'20128,188,606'Solder bump interconnect'20127,973,418'Solder bump interconnect for improved mechanical and thermo-mechanical performance'20116,455,922'Deformation-absorbing leadframe for semiconductor devices'2002Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2002Based in Tempe, AZ, US· patent location history
2011–2013Patents assigned to FLIPCHIP INT LLC (3)· patent assignee history
2011–2013Based in Chandler, AZ, US· patent location history
2012–2016Patents assigned to MAXIM INTEGRATED PRODUCTS (5)· patent assignee history
2012–2014Patents assigned to ALVARADO REYNANTE (4)· patent assignee history
2012–2014Patents assigned to LO CHIUNG C (2)· patent assignee history
2012–2014Based in San Jose, CA, US· patent location history
2015–2018Patents assigned to QUALCOMM INC (8)· patent assignee history
2015–2018Based in San Diego, CA, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| QUALCOMM INC | 8 | 2015–2018 |
| MAXIM INTEGRATED PRODUCTS | 5 | 2012–2016 |
| ALVARADO REYNANTEself | 4 | 2012–2014 |
| FLIPCHIP INT LLC | 3 | 2011–2013 |
| LO CHIUNG C | 2 | 2012–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| San Diego, California, US | 10 | 2015–2018 |
| San Jose, California, US | 3 | 2012–2014 |
| Chandler, AZ, US | 3 | 2011–2013 |
| Tempe, AZ, US | 1 | 2002 |