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Inventor

Tsukasa Katsuyama

Inventor
Iruma, JP

Overview

1→
Patents
2021
Patent span
Electricity
Primary field (CPC H)

Patents· 1 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B23Kprimary
B23KSoldering or unsoldering20%
C22CAlloys20%
H01LSemiconductor devices20%
H05KPrinted circuits20%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1020%
PatentTitleYear
10,926,360Lead-free solder alloy, solder joint, solder paste composition, electronic circuit board, and electronic device2021

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2021Patents assigned to TAMURA SEISAKUSHO KK (1)· patent assignee history
2021Based in Iruma, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TAMURA SEISAKUSHO KK12021
Locations
LocationPatentsSpan
Iruma, JP12021