Inventor
WAN-YU LEE
Inventor
TW
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1020%
G02BOptical elements, systems or apparatus7%
H01SDevices using the process of light amplification by stimulated emission of radiation [laser] to amplify or generate light7%
PatentTitleYear
11,984,410Air channel formation in packaging process202411,682,637Air channel formation in packaging process202311,415,762Optical bench, method of making and method of using202211,328,972Temporary bonding scheme202211,139,282Semiconductor package structure and method for manufacturing the same2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2024Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (5)· patent assignee history
2021–2024Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 5 | 2021–2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 5 | 2021–2024 |