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Inventor

YANG-CHOU LIN

Inventor
TW

Overview

2→
Patents
2022–2024
Patent span
Electricity
Primary field (CPC H)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices33%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1033%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
PatentTitleYear
12,183,626Metal interconnect structure having cap layer with different thicknesses and method for fabricating the same202411,450,558Metal interconnect structure and method for fabricating the same2022

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2022–2024Patents assigned to UNITED MICROELECTRONICS CORP (2)· patent assignee history
2022–2024Based in TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
UNITED MICROELECTRONICS CORP22022–2024
Locations
LocationPatentsSpan
TW22022–2024