Inventor

Kurt Weiblen

Inventor
Metzingen, DE

Overview

31→
Patents
1993–2009
Patent span
Physics
Primary field (CPC G)

Patents· 31 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G01Lprimary
G01LMeasuring force, stress, torque, work, mechanical power, mechanical efficiency, or fluid pressure21%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1017%
G01PMeasuring linear or angular speed, acceleration, deceleration, or shock7%
H05KPrinted circuits7%
B81BMicrostructural devices or systems, e.g. micromechanical devices5%
B29CShaping or joining of plastics3%
G01DMeasuring not specially adapted for a specific variable3%
G01FMeasuring volume, volume flow, mass flow or liquid level3%
H01RElectrically-conductive connections3%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation3%
PatentTitleYear
7,585,662'Container for an analysis chip'20097,437,943'Force measurement element'20087,323,766'Sensor module'20087,064,403'Chip assembly in a premold housing'20066,872,911'Welding method'20056,837,117'Device and method for measuring a force component or torque component'20056,804,883'Method for producing a pressure sensor'20046,778,400'Electronic device'20046,711,033'Sealed housing for an electronic device and the respective seal'20046,661,668'Housing and methods of producing a housing'20036,528,868'Lead frame device and method for producing the same'20036,354,153'Pressure sensor connection device'20026,300,169'Method for manufacturing a pressure sensor'20016,300,842'Arrangement for producing electrical oscillations'20016,271,471'Housing for electronic component, and method of producing the same'20016,106,735'Wafer stack and method of producing sensors'20006,062,088'Pressure sensor'20006,021,674'Pressure sensor having at least one connector element arranged flush with a mounting surface and a capillary adhesive layer arranged between a support plate and the mounting surface'20005,723,784'Flow rate meter'19985,721,377'Angular velocity sensor with built-in limit stops'19985,648,615'Pressure sensor providing improved connection to a circuit board'19975,646,347'Suspension for micromechanical structure and micromechanical acceleration sensor'19975,606,117'Pressure sensor for measuring pressure in an internal combustion engine'19975,600,074'Silicon chip for use in a force-detection sensor'19975,547,730'Device having a mounting board and method for applying a passivating gel'19965,525,943'Electromagnetic compatibility filter utilizing inherently formed capacitance'19965,507,186'Pressure sensor'19965,404,753'Mass flow sensor'19955,273,939'Method of assembling micromechanical sensors'19935,261,639'Valve'19935,248,028'Apparatus for firing printed matter onto substrates'1993

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1993–2009Patents assigned to BOSCH GMBH ROBERT (31)· patent assignee history
1993–2009Based in Metzingen, DE· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
BOSCH GMBH ROBERT311993–2009
Locations
LocationPatentsSpan
Metzingen, DE311993–2009