Inventor
Ronald L. Spreitzer
Inventor
Phoenix, AZ, US
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1036%
H05KPrinted circuits27%
Y10TTechnical subjects covered by former us classification27%
Y02PClimate change mitigation technologies in the production or processing of goods9%
PatentTitleYear
7,818,878'Integrated circuit device mounting with folded substrate and interposer'20107,358,444'Folded substrate with interposer package for integrated circuit devices'20087,304,373'Power distribution within a folded flex package method and apparatus'20077,302,756'Bond finger on via substrate, process of making same, package made thereby, and method of assembling same'2007Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2007–2010Patents assigned to INTEL CORP (4)· patent assignee history
2007–2010Based in Phoenix, AZ, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 4 | 2007–2010 |
Locations
| Location | Patents | Span |
|---|---|---|
| Phoenix, AZ, US | 4 | 2007–2010 |