Inventor
Yoshitaka Toyoda
Inventor
Tokyo, JP
Overview
Patents· 26 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H04Nprimary
H04NPictorial communication, e.g. television26%
B23KSoldering or unsoldering21%
G06TImage data processing or generation, in general21%
H05KPrinted circuits11%
C22CAlloys9%
G01RMeasuring electric variables2%
G02BOptical elements, systems or apparatus2%
G06KGraphical data reading2%
G07DHandling of coins or valuable papers, e.g. testing, sorting by denominations, counting, dispensing, changing or depositing2%
Y02PClimate change mitigation technologies in the production or processing of goods2%
PatentTitleYear
10,951,817Compound-eye imaging device, image processing method, and recording medium202110,699,395Image processing device, image processing method, and image capturing device202010,657,629Image reading device202010,506,124Image reading apparatus201910,275,970Signal processing device, signal processing method and information reading apparatus201910,269,128Image processing device and method, and recording medium201910,255,665Image processing device and method, image capturing device, program, and record medium201910,049,432Image processing apparatus, image processing method, program and recording medium20189,936,098Image combination device, image reading device and image combination method20189,875,523Image processing apparatus and image processing method20189,779,477'Image enlarging apparatus, image enlarging method, surveillance camera, program and recording medium'20179,770,786'Lead-free solder paste'20179,349,168'Image processing device and method to correct brightness signal of an input image'20169,153,015'Image processing device and method'20158,648,859'Image display apparatus, image processing apparatus and method to output an image with high perceived resolution'20148,249,379'Image processing apparatus and method and image display apparatus'20128,216,395'Lead-free solder alloy'20127,682,468'Lead-free solder alloy'20107,681,777'Solder paste and printed circuit board'20107,338,567'Lead-free solder alloy'20087,282,175'Lead-free solder'20077,282,174'Lead-free solder and soldered article'20077,029,542'Lead-free solder alloy'20066,554,180'Lead-free solder paste'20036,503,338'Lead-free solder alloys'20036,050,480'Solder paste for chip components'2000Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2000–2017Patents assigned to SENJU METAL INDUSTRY CO (10)· patent assignee history
2000–2017Based in Satte, JP· patent location history
2012–2021Patents assigned to MITSUBISHI ELECTRIC CORP (15)· patent assignee history
2012–2017Patents assigned to TOYODA YOSHITAKA (6)· patent assignee history
2012–2014Patents assigned to MINAMI KOJI (2)· patent assignee history
2012–2021Based in Tokyo, JP· patent location history
2015–2016Patents assigned to MATOBA NARIHIRO (2)· patent assignee history
2017–2020Based in Chiyoda-ku, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MITSUBISHI ELECTRIC CORP | 15 | 2012–2021 |
| SENJU METAL INDUSTRY CO | 10 | 2000–2017 |
| TOYODA YOSHITAKAself | 6 | 2012–2017 |
| MATOBA NARIHIRO | 2 | 2015–2016 |
| MINAMI KOJI | 2 | 2012–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tokyo, JP | 13 | 2012–2021 |
| Satte, JP | 10 | 2000–2017 |
| Chiyoda-ku, JP | 3 | 2017–2020 |