LexDanaLexDanabeta
Inventor

Kei Murayama

Inventor
Nagano, JP

Overview

124→
Patents
1998–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 124 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1034%
H05KPrinted circuits14%
H10HInorganic light-emitting semiconductor devices having potential barriers7%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h106%
Y10TTechnical subjects covered by former us classification6%
H01LSemiconductor devices4%
B81BMicrostructural devices or systems, e.g. micromechanical devices3%
Y02PClimate change mitigation technologies in the production or processing of goods3%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems2%
H10DInorganic electric semiconductor devices2%
PatentTitleYear
10,784,226Semiconductor device202010,446,512Conductive ball and electronic device201910,446,513Conductive ball having a tin-based solder covering an outer surface of the copper ball20199,802,503'Power management device'20179,716,053'Semiconductor device, heat conductor, and method for manufacturing semiconductor device'20179,633,964'Wiring substrate and electronic component device'20179,591,742'Interposer and semiconductor device including the same'20179,496,725'Power control apparatus, method, program, and integrated circuit, and storage battery unit'20169,425,892'Information processing apparatus, information processing method, and program'20169,374,889'Interposer and electronic component package'20169,179,568'Electronic device'20159,129,884'Solder bump joining structure with low resistance joining member'20159,112,421'Converter circuit including switch element unit'20159,105,989'Connection structure, wiring substrate unit, electronic circuit part unit, and electronic apparatus'20158,841,760'Stacked semiconductor device and method of manufacturing the same'20148,836,119'Semiconductor device'20148,674,499'Heat radiation component and semiconductor package including same'20148,622,556'Frame-attached anti-reflection glass and method of manufacturing the same'20148,598,684'Semiconductor device, and method of manufacturing the same'20138,481,863'Substrate and method for manufacturing the same'20138,394,678'Semiconductor chip stacked body and method of manufacturing the same'20138,368,206'Heat radiation package and semiconductor device'20138,350,390'Wiring substrate and semiconductor device'20138,338,289'Method of manufacturing a semiconductor chip including a semiconductor substrate and a through via provided in a through hole'20128,330,050'Wiring board having heat intercepting member'20128,227,909'Semiconductor package and method of manufacturing the same'20128,221,997'Microorganism and method for producing carotenoid using the same'20128,183,469'Wiring board and method of manufacturing the same'20128,178,957'Electronic component device, and method of manufacturing the same'20128,169,073'Semiconductor device and electronic apparatus of multi-chip packaging'20128,148,738'Semiconductor device having an element mounted on a substrate and an electrical component connected to the element'20128,137,497'Method of manufacturing wiring substrate'20128,129,830'Electronic component package and method of manufacturing the same, and electronic component device'20128,111,523'Wiring board with switching function and method of manufacturing the same'20128,108,993'Method of manufacturing wiring substrate, and method of manufacturing semiconductor device'20128,106,484'Silicon substrate for package'20128,100,555'Lighting apparatus'20128,080,122'Method of manufacturing wiring substrate and method of manufacturing semiconductor device'20118,046,911'Method for mounting electronic component on substrate and method for forming solder surface'20118,044,429'Light-emitting device and method for manufacturing the same'20118,026,576'Wiring board'20118,026,610'Silicon interposer and method for manufacturing the same'20118,022,872'Positioning receiver'20118,003,895'Electronic parts packaging structure and method of manufacturing the same'20117,989,927'Silicon substrate for package'20117,981,798'Method of manufacturing substrate'20117,964,950'Electronic parts packaging structure and method of manufacturing the same'20117,960,820'Semiconductor package'20117,948,092'Electronic component and method for manufacturing the same'20117,911,048'Wiring substrate'20117,897,510'Semiconductor device package, semiconductor apparatus, and methods for manufacturing the same'20117,894,201'Electronic component and method for manufacturing the same'20117,888,953'Probe card'20117,884,632'Semiconductor inspecting device'20117,882,626'Method of manufacturing wiring board having a semiconductor thereon'20117,876,036'Light emitting apparatus and manufacturing method therefor'20117,850,344'Light emitting device housing and a manufacturing method thereof, and light emitting apparatus using the same'20107,843,068'Semiconductor chip and method of manufacturing the same'20107,838,897'Light-emitting device and method for manufacturing the same'20107,834,438'Sealed structure and method of fabricating sealed structure and semiconductor device and method of fabricating semiconductor device'20107,829,993'Semiconductor apparatus'20107,825,423'Semiconductor device and method of manufacturing semiconductor device'20107,816,690'Light-emitting device'20107,807,561'Method for forming side wirings'20107,794,112'Lighting apparatus'20107,795,140'Method of manufacturing substrate'20107,777,349'Semiconductor apparatus having side surface wiring'20107,708,613'Method of producing light emitting apparatus'20107,705,451'Semiconductor device and method of manufacturing the same'20107,691,673'Electronic parts packaging structure and method of manufacturing the same'20107,655,956'Semiconductor device and method for manufacturing the same'20107,622,747'Light emitting device and manufacturing method thereof'20097,573,135'Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film'20097,563,987'Electronic parts packaging structure and method of manufacturing the same'20097,557,450'Wiring substrate and electronic parts packaging structure'20097,545,049'Electronic parts packaging structure'20097,530,163'Electronic parts packaging structure and method of manufacturing the same'20097,524,025'Inkjet printer'20097,508,057'Electronic component device'20097,498,200'Electronic-parts-packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film'20097,494,898'Method for manufacturing semiconductor device'20097,488,094'Semiconductor device and manufacturing method of semiconductor device'20097,470,891'Optical device'20087,420,128'Electronic component embedded substrate and method for manufacturing the same'20087,330,037'Electrical characteristic measuring probe and method of manufacturing the same'20087,285,862'Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film'20077,285,728'Electronic parts packaging structure and method of manufacturing the same'20077,279,771'Wiring board mounting a capacitor'20077,251,391'Optical waveguide mounting member, substrate, semiconductor device, method of manufacturing optical waveguide mounting member, and method of manufacturing substrate'20077,221,816'Substrate, semiconductor device, method of manufacturing substrate, and method of manufacturing semiconductor device'20077,217,888'Electronic parts packaging structure and method of manufacturing the same'20077,183,647'Wiring substrate and electronic parts packaging structure'20077,134,195'Method of production of multilayer circuit board with built-in semiconductor chip'20067,084,009'Method of manufacturing a packaging structure for electronic parts buried in an insulating film formed on the electronic parts and a wiring substrate'20067,084,006'Electronic parts packaging structure and method of manufacturing the same'20067,067,353'Method for manufacturing semiconductor package having electrodes penetrating through semiconductor wafer'20067,061,261'Semiconductor inspection device and method for manufacturing contact probe'20067,057,290'Electronic parts packaging structure and method of manufacturing the same'20066,974,721'Method for manufacturing thin semiconductor chip'20056,958,298'Method for thinning wafer by grinding'20056,943,442'Electronic parts packaging structure having mutually connected electronic parts that are buried in a insulating film'20056,930,392'Electronic parts packaging structure and method of manufacturing the same'20056,864,120'Semiconductor device having a carbon fiber reinforced resin as a heat radiation plate having a concave portion'20056,861,284'Semiconductor device and production method thereof'20056,835,597'Semiconductor package'20046,831,000'Semiconductor device manufacturing method'20046,803,664'Semiconductor package'20046,797,603'Semiconductor device and method of production of same'20046,738,504'Inspection apparatus for semiconductor device and parts mounter using same'20046,713,863'Semiconductor device having a carbon fiber reinforced resin as a heat radiation plate having a concave portion'20046,548,326'Semiconductor device and process of producing same'20036,538,332'Semiconductor device and method of production of same'20036,522,022'Mounting structure for semiconductor devices'20036,522,719'Method and apparatus for measuring a bump on a substrate'20036,420,787'Semiconductor device and process of producing same'20026,404,070'Semiconductor device'20026,344,695'Semiconductor device to be mounted on main circuit board and process for manufacturing same device'20026,312,551'Method for mounting semiconductor chip onto circuit board'20016,303,998'Semiconductor device having a chip mounted on a rectangular substrate'20016,281,592'Package structure for semiconductor chip'20016,281,567'Substrate for mounting semiconductor chip with parallel conductive lines'20016,081,038'Semiconductor chip package structure'20005,777,386'Semiconductor device and mount structure thereof'19985,736,780'Semiconductor device having circuit pattern along outer periphery of sealing resin and related processes'1998

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1998–2020Patents assigned to SHINKO ELECTRIC IND CO (115)· patent assignee history
1998–2020Based in Nagano, JP· patent location history
2011–2016Patents assigned to MURAYAMA KEI (23)· patent assignee history
2011–2013Patents assigned to HIGASHI MITSUTOSHI (11)· patent assignee history
2011–2013Patents assigned to SUNOHARA MASAHIRO (11)· patent assignee history
2012–2014Patents assigned to SHIRAISHI AKINORI (10)· patent assignee history
2012Based in Yamamoto, JP· patent location history
2015–2017Based in Osaka, JP· patent location history
2016Based in Ishikawa, JP· patent location history
2016Based in Tokyo, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
SHINKO ELECTRIC IND CO1151998–2020
MURAYAMA KEIself232011–2016
HIGASHI MITSUTOSHI112011–2013
SUNOHARA MASAHIRO112011–2013
SHIRAISHI AKINORI102012–2014
Locations
LocationPatentsSpan
Nagano, JP1181998–2020
Osaka, JP22015–2017
Ishikawa, JP12016
Tokyo, JP12016
Yamamoto, JP12012