Inventor
Para K. Segaram
Inventor
Brookfield, AU
Overview
Patents· 43 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1021%
H05KPrinted circuits19%
H01RElectrically-conductive connections16%
H04LTransmission of digital information, e.g. telegraphic communication12%
G06FElectric digital data processing7%
H03HImpedance networks, e.g. resonant circuits4%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests4%
G01RMeasuring electric variables3%
H01CResistors3%
H01GCapacitors3%
PatentTitleYear
8,598,696'Multi-surface IC packaging structures'20138,338,713'Cabled signaling system and components thereof'20128,324,727'Low profile discrete electronic components and applications of same'20128,313,333'Connector having a housing with a conductor with a ramp section and a curved surface section'20128,244,993'Memory chain'20128,079,848'Electrical connector with conductors with a ramp to induce torsion'20118,047,855'High speed, direct path, stair-step, electronic connectors with improved signal integrity characteristics and methods for their manufacture'20117,989,929'Direct-connect signaling system'20117,973,391'Tapered dielectric and conductor structures and applications thereof'20117,966,443'Memory systems including memory devices coupled together in a daisy-chained arrangement'20117,919,355'Multi-surface IC packaging structures and methods for their manufacture'20117,909,615'Torsionally-induced contact-force conductors for electrical connector systems'20117,845,986'Torsionally-induced contact-force conductors for electrical connector systems'20107,737,545'Multi-surface IC packaging structures and methods for their manufacture'20107,732,904'Multi-surface contact IC packaging structures and assemblies'20107,701,323'Low profile discrete electronic components and applications of same'20107,652,381'Interconnect system without through-holes'20107,651,336'High speed, direct path, stair-step, electronic connectors with improved signal integrity characteristics and methods for their manufacture'20107,613,011'Signal-segregating connector system'20097,593,470'High-speed communication system with a feedback synchronization loop'20097,408,995'High speed communication system with a feedback synchronization loop'20087,388,279'Tapered dielectric and conductor structures and applications thereof'20087,307,293'Direct-connect integrated circuit signaling system for bypassing intra-substrate printed circuit signal paths'20077,308,524'Memory chain'20077,279,783'Partitioned integrated circuit package with central clock driver'20077,278,855'High speed, direct path, stair-step, electronic connectors with improved signal integrity characteristics and methods for their manufacture'20077,240,052'Refinement of a search query based on information stored on a local storage medium'20077,227,759'Signal-segregating connector system'20077,111,108'Memory system having a multiplexed high-speed channel'20067,092,449'High-speed communication system with a feedback synchronization loop'20067,061,096'Multi-surface IC packaging structures and methods for their manufacture'20067,039,118'High speed communication system with a feedback synchronization loop'20067,014,472'System for making high-speed connections to board-mounted modules'20066,933,610'Method of bonding a semiconductor die without an ESD circuit and a separate ESD circuit to an external lead, and a semiconductor device made thereby'20056,884,120'Array connector with deflectable coupling structure for mating with other components'20056,775,328'High-speed communication system with a feedback synchronization loop'20046,185,226'Integrated twisted pair filter with a secure RIC function'20015,822,325'Integrated twisted pair filter with a secure RIC function'19985,410,188'Enhanced integrated waveshaping circuit'19955,357,145'Integrated waveshaping circuit using weighted current summing'19945,336,946'Differential output stage with reduced idle current'19945,061,900'Self-zeroing amplifier'19914,954,785'Auto tracking notch filter using switched capacitors to measure harmonic distortion and noise contained in a signal source'1990Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1990–2012Based in Campbell, CA, US· patent location history
2005–2007Patents assigned to SILICON PIPE INC (8)· patent assignee history
2006–2013Based in Brookfield, AU· patent location history
2006–2012Based in Cupertino, CA, US· patent location history
2008–2012Patents assigned to INTERCONNECT PORTFOLIO LLC (11)· patent assignee history
2011–2013Patents assigned to SAMSUNG ELECTRONICS CO LTD (9)· patent assignee history
2011–2013Patents assigned to SEGARAM PARA K (6)· patent assignee history
2011–2013Patents assigned to FJELSTAD JOSEPH C (5)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTERCONNECT PORTFOLIO LLC | 11 | 2008–2012 |
| SAMSUNG ELECTRONICS CO LTD | 9 | 2011–2013 |
| SILICON PIPE INC | 8 | 2005–2007 |
| SEGARAM PARA Kself | 6 | 2011–2013 |
| FJELSTAD JOSEPH C | 5 | 2011–2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Brookfield, AU | 19 | 2006–2013 |
| Campbell, California, US | 18 | 1990–2012 |
| Cupertino, California, US | 6 | 2006–2012 |