Inventor
Kazuo Anzai
Inventor
Tokyo, JP
Overview
Patents· 17 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C04Bprimary
C04BLime, magnesia22%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests19%
B22DCasting of metals11%
B29CShaping or joining of plastics8%
H05KPrinted circuits8%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h108%
Y10TTechnical subjects covered by former us classification8%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts6%
B22FWorking metallic powder3%
C22CAlloys3%
PatentTitleYear
7,837,811'Method for manufacturing a composite of carbon nanomaterial and metallic material'20107,331,372'Method for melting metallic raw material in metal molding apparatus'20087,165,599'Melting and feeding method and apparatus of metallic material in metal molding machine'20077,036,551'Method of molding low melting point metal alloy'20067,032,640'Method of molding low melting point metal alloy'20065,560,708'Vent apparatus for an injection molding machine'19965,556,581'Method of injection molding polyethylene terephthalate'19965,534,204'Method of injection molding polyethylene terephthalate'19965,063,121'Circuit substrate comprising nitride type ceramics, method for preparing it, and metallizing composition for use in it'19915,001,089'Aluminum nitride sintered body'19914,883,780'Aluminum nitride sintered body and preparation thereof'19894,883,704'Circuit substrate comprising nitride type ceramics, method for preparing it, and metallizing composition for use in it'19894,766,097'Aluminum nitride-based sintered body of high thermal conductivity'19884,750,003'Magnetic display unit'19884,746,637'Aluminum nitride sintered body and process for producing the same'19884,698,320'Aluminum nitride sintered body'19874,659,611'Circuit substrate having high thermal conductivity'1987Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1987–1991Patents assigned to TOSHIBA KK (8)· patent assignee history
1987–1989Based in Tokyo, JP· patent location history
1988Patents assigned to PILOT PEN CO LTD (1)· patent assignee history
1988Based in Kanagawa, JP· patent location history
1991Based in Worcester, MA, US· patent location history
1996–2010Patents assigned to NISSEI PLASTICS IND CO (8)· patent assignee history
1996–2008Based in Nagano, JP· patent location history
1996–2010Based in Hanishina-gun, JP· patent location history
2010Patents assigned to CHIBA INST TECHNOLOGY (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| NISSEI PLASTICS IND CO | 8 | 1996–2010 |
| TOSHIBA KK | 8 | 1987–1991 |
| CHIBA INST TECHNOLOGY | 1 | 2010 |
| PILOT PEN CO LTD | 1 | 1988 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tokyo, JP | 6 | 1987–1989 |
| Nagano, JP | 5 | 1996–2008 |
| Hanishina-gun, JP | 3 | 1996–2010 |
| Worcester, Massachusetts, US | 2 | 1991 |
| Kanagawa, JP | 1 | 1988 |