Inventor
DOMINIC MAIER
Inventor
DE
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B81Bprimary
B81BMicrostructural devices or systems, e.g. micromechanical devices13%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems13%
G01NInvestigating or analysing materials by determining their chemical or physical properties13%
H01LSemiconductor devices8%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h108%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form4%
G01HMeasurement of mechanical vibrations or ultrasonic, sonic or infrasonic waves4%
G01JMeasurement of intensity, velocity, spectral content, polarisation, phase or pulse characteristics of infrared, visible or ultraviolet light4%
G01LMeasuring force, stress, torque, work, mechanical power, mechanical efficiency, or fluid pressure4%
PatentTitleYear
11,609,180Emitter package for a photoacoustic sensor202311,492,249MEMS sensor, MEMS sensor system and method for producing a MEMS sensor system202211,279,120Device and method for debonding a structure from a main surface region of a carrier202211,211,298System and method for a transducer in an EWLB package202111,195,787Semiconductor device including an antenna2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2023Patents assigned to INFINEON TECHNOLOGIES AG (5)· patent assignee history
2021–2023Based in DE· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INFINEON TECHNOLOGIES AG | 5 | 2021–2023 |
Locations
| Location | Patents | Span |
|---|---|---|
| DE | 5 | 2021–2023 |