Inventor

Kazunori Kondo

Inventor

Annaka, JP

Overview

2003–2020

Patent span

Chemistry

Primary field (CPC C)

Patents· 38 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

C08Lprimary

C08LCompositions of macromolecular compounds10%

C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds10%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h109%

C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients8%

H01LSemiconductor devices8%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h107%

C09DCoating compositions, e.g. paints, varnishes or lacquers7%

C09JAdhesives7%

B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form5%

C08JWorking-up5%

PatentTitleYear

10,850,482Resin composition, resin film, semiconductor laminate, method for manufacturing semiconductor laminate, and method for manufacturing semiconductor device2020 10,796,939Temporary adhesive film roll for substrate processing, method for manufacturing thin wafer2020 10,730,273Resin composition, resin film, semiconductor laminate, method for manufacturing semiconductor laminate, and method for manufacturing semiconductor device2020 10,719,015Positive resist film laminate and pattern forming process2020 10,538,630Silicone-modified polybenzoxazole resin and making method2020 10,514,601Chemically amplified positive resist film laminate and pattern forming process2019 10,503,067Photosensitive resin composition, photosensitive dry film, photosensitive resin coating, and pattern forming process2019 10,451,970Silicone skeleton-containing polymer, photo-curable resin composition, photo-curable dry film, laminate, and patterning process2019 10,428,239Resin composition, resin film, method for producing resin film, method for producing semiconductor device, and semiconductor device2019 10,377,923Surface protective film, making method, and substrate processing laminate2019 10,373,903Laminate and making method2019 10,319,653Semiconductor apparatus, stacked semiconductor apparatus, encapsulated stacked-semiconductor apparatus, and method for manufacturing the same2019 10,308,787Resin composition, resin film, method for producing resin film, method for producing semiconductor device, and semiconductor device2019 10,297,485Semiconductor device, making method, and laminate2019 10,141,272Semiconductor apparatus, stacked semiconductor apparatus and encapsulated stacked-semiconductor apparatus each having photo-curable resin layer2018 10,035,912Flame retardant resin composition, flame retardant resin film, semiconductor device, and making method2018 10,026,650Resin composition, resin film, semiconductor device and method of manufacture thereof2018 9,929,068'Film-like wafer mold material, molded wafer, and semiconductor device'2018 9,890,254'Resin composition, resin film, and semiconductor device and method for manufacturing same'2018 9,472,438'Wafer processing laminate, wafer processing member, temporary adhering material for processing wafer, and manufacturing method of thin wafer'2016 9,447,305'Silicone resin, resin composition, resin film, semiconductor device, and making method'2016 8,883,913'Resin composition, resin film, semiconductor device, and production method thereof'2014 8,808,865'Adhesive composition, and adhesive sheet, semiconductor apparatus-protective material and semiconductor apparatus using the same'2014 8,796,410'Polymer having silphenylene and siloxane structures, a method of preparing the same, an adhesive composition, an adhesive sheet, a protective material for a semiconductor device, and a semiconductor device'2014 8,673,537'Photo-curable resin composition, pattern forming method and substrate protecting film, and film-shaped adhesive and adhesive sheet using said composition'2014 8,596,726'Wheel for vehicle'2013 8,501,879'Adhesive composition, adhesive sheet, semiconductor apparatus protection material, and semiconductor apparatus'2013 8,466,041'Method for manufacturing lamination type semiconductor integrated device'2013 8,408,622'Frame molding'2013 8,315,780'High pressure fuel pump control apparatus for internal combustion engine'2012 8,226,143'Joint structure of door edge member'2012 7,820,740'Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same'2010 7,820,741'Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same'2010 7,524,563'Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same'2009 7,524,394'Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same'2009 7,348,057'Acrylic adhesive sheet'2008 7,157,093'Oil cleaning sheets for makeup'2007 6,602,929'Liquid radiation-curable resin composition, optical fiber coating composition, and optical fiber'2003

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2003–2020Patents assigned to SHINETSU CHEMICAL CO (32)· patent assignee history

2003–2020Based in Annaka, JP· patent location history

2009–2010Based in Kamisu, JP· patent location history

2012–2018Patents assigned to KONDO KAZUNORI (9)· patent assignee history

2012–2013Patents assigned to AISIN SEIKI (2)· patent assignee history

2012–2013Based in Toyota, JP· patent location history

2013–2018Patents assigned to SUGO MICHIHIRO (4)· patent assignee history

2013–2014Patents assigned to KATO HIDETO (3)· patent assignee history

2013Based in Tokyo, JP· patent location history

2014–2020Based in Takasaki, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
SHINETSU CHEMICAL CO	32	2003–2020
KONDO KAZUNORIself	9	2012–2018
SUGO MICHIHIRO	4	2013–2018
KATO HIDETO	3	2013–2014
AISIN SEIKI	2	2012–2013

Locations

Location	Patents	Span
Annaka, JP	18	2003–2020
Takasaki, JP	10	2014–2020
Kamisu, JP	4	2009–2010
Toyota, JP	2	2012–2013
Tokyo, JP	1	2013