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Inventor

Woon Yik Yong

Inventor
Singapore, SG

Overview

3→
Patents
2015–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices38%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1038%
G01SRadio direction-finding13%
H01SDevices using the process of light amplification by stimulated emission of radiation [laser] to amplify or generate light13%
PatentTitleYear
10,978,378Encapsulated leadless package having an at least partially exposed interior sidewall of a chip carrier202110,872,848Semiconductor package with leadframe interconnection structure20209,082,737'System and method for an electronic package with a fail-open mechanism'2015

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2015–2021Patents assigned to INFINEON TECHNOLOGIES AG (3)· patent assignee history
2015–2020Based in Singapore, SG· patent location history
2021Based in Malacca, MY· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
INFINEON TECHNOLOGIES AG32015–2021
Locations
LocationPatentsSpan
Singapore, SG22015–2020
Malacca, MY12021