Inventor
Andrew T. Appel
Inventor
Dallas, TX, US
Overview
Patents· 14 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B24Bprimary
B24BMachines, devices, or processes for grinding or polishing23%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests23%
H10DInorganic electric semiconductor devices18%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1018%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1014%
G06FElectric digital data processing5%
PatentTitleYear
7,977,230'Rectangular contact used as a low voltage fuse element'20117,442,626'Rectangular contact used as a low voltage fuse element'20086,774,457'Rectangular contact used as a low voltage fuse element'20046,653,681'Additional capacitance for MIM capacitors with no additional processing'20036,150,669'Combination test structures for in-situ measurements during fabrication of semiconductor devices'20006,030,864'Vertical NPN transistor for 0.35 micrometer node CMOS logic technology'20005,906,754'Apparatus integrating pad conditioner with a wafer carrier for chemical-mechanical polishing applications'19995,755,979'Application of semiconductor IC fabrication techniques to the manufacturing of a conditioning head for pad conditioning during chemical-mechanical polish'19985,605,861'Thin polysilicon doping by diffusion from a doped silicon dioxide film'19975,595,922'Process for thickening selective gate oxide regions'19975,595,527'Application of semiconductor IC fabrication techniques to the manufacturing of a conditioning head for pad conditioning during chemical-mechanical polish'19975,536,202'Semiconductor substrate conditioning head having a plurality of geometries formed in a surface thereof for pad conditioning during chemical-mechanical polish'19965,522,965'Compact system and method for chemical-mechanical polishing utilizing energy coupled to the polishing pad/water interface'19965,088,036'Real time, concurrent garbage collection system and method'1992Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1992Patents assigned to DIGITAL EQUIPMENT CORP (1)· patent assignee history
1992Based in Princeton, NJ, US· patent location history
1996–2011Patents assigned to TEXAS INSTRUMENTS INC (13)· patent assignee history
1996–2000Based in Dallas, TX, US· patent location history
2003–2011Based in Bloomington, IN, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TEXAS INSTRUMENTS INC | 13 | 1996–2011 |
| DIGITAL EQUIPMENT CORP | 1 | 1992 |
Locations
| Location | Patents | Span |
|---|---|---|
| Dallas, Texas, US | 9 | 1996–2000 |
| Bloomington, IN, US | 4 | 2003–2011 |
| Princeton, New Jersey, US | 1 | 1992 |