Inventor
Bin Lian
Inventor
Hillsboro, OR, US
Overview
Patents· 16 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1031%
H05KPrinted circuits14%
F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact6%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application6%
H10DInorganic electric semiconductor devices6%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests6%
B01LChemical or physical laboratory apparatus for general use3%
C21DModifying the physical structure of ferrous metals3%
C22FChanging the physical structure of non-ferrous metals and non-ferrous alloys3%
F16FSprings3%
PatentTitleYear
8,968,684'Microplates, reaction modules and detection systems'20157,057,114'Circuit board with added impedance'20066,913,999'Semiconductor device with components embedded in backside diamond layer'20056,797,085'Metallurgically enhanced heat sink'20046,775,122'Circuit board with added impedance'20046,774,310'Surface mount connector lead'20046,752,204'Iodine-containing thermal interface material'20046,731,221'Electrically modifiable product labeling'20046,649,937'Semiconductor device with components embedded in backside diamond layer'20036,648,506'Fluorescence emission ratio imaging thermography for use in heat transfer analysis'20036,624,643'Apparatus and method to read output information from a backside of a silicon device'20036,550,531'Vapor chamber active heat sink'20036,521,516'Process for local on-chip cooling of semiconductor devices using buried microchannels'20036,486,589'Circuit card assembly having controlled vibrational properties'20026,359,372'Circuit card assembly having controlled expansion properties'20026,327,145'Heat sink with integrated fluid circulation pump'2001Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2001–2006Patents assigned to INTEL CORP (14)· patent assignee history
2001–2006Based in Hillsboro, OR, US· patent location history
2003Patents assigned to UNIV MICHIGAN STATE (1)· patent assignee history
2003–2015Based in Portland, OR, US· patent location history
2015Patents assigned to LIAN BIN (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 14 | 2001–2006 |
| LIAN BINself | 1 | 2015 |
| UNIV MICHIGAN STATE | 1 | 2003 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hillsboro, OR, US | 12 | 2001–2006 |
| Portland, OR, US | 4 | 2003–2015 |