Inventor
Takayuki Higuchi
Inventor
Osaka, JP
Overview
Patents· 20 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C04Bprimary
C04BLime, magnesia16%
H05KPrinted circuits11%
Y02WClimate change mitigation technologies related to wastewater treatment or waste management9%
Y10TTechnical subjects covered by former us classification9%
H01BCables7%
Y02PClimate change mitigation technologies in the production or processing of goods7%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h105%
C08JWorking-up4%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients4%
C09JAdhesives4%
PatentTitleYear
10,509,351Fixing device fixing developing agent image to sheet by electrostatically spraying charged fixing solution201910,300,572Workpiece loader device201910,093,577Fiber-reinforced carbonated hydraulic inorganic molded plate and method for producing same20189,348,252'Image forming apparatus'20168,697,237'Thermosetting resin composition, method of manufacturing the same and circuit board'20148,663,384'Cement admixture and cement composition'20148,663,383'Expansive material and its preparation process'20148,540,903'Electrically conductive paste, and electrical and electronic device comprising the same'20138,436,253'Method of manufacturing mounting structure and mounting structure'20138,425,679'Calcium ferroaluminate compound, cement admixture and its manufacturing methods, and cement composition'20138,383,714'Alumina fiber aggregate, process for producing the same, and use thereof'20138,273,816'Alumina fiber aggregate, process for producing the same, and use thereof'20128,182,923'Conductive paste and mounting structure using the same'20128,163,599'Flip-chip mounting method, flip-chip mounting apparatus and tool protection sheet used in flip-chip mounting apparatus'20128,012,379'Electroconductive bonding material and electric/electronic device using the same'20117,785,500'Electrically conductive adhesive'20107,527,689'Cement admixture, cement composition, and method for suppressing carbonation using the same'20097,459,020'Cement admixture, cement composition, and cement concrete made therefrom'20087,207,841'Electrical connector'20076,840,996'Cement composition'2005Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2005–2014Patents assigned to DENKI KAGAKU KOGYO KK (8)· patent assignee history
2005–2009Based in Niigata, JP· patent location history
2007–2013Based in Tokyo, JP· patent location history
2010–2014Patents assigned to PANASONIC CORP (7)· patent assignee history
2010–2014Based in Osaka, JP· patent location history
2012–2014Patents assigned to HIGUCHI TAKAYUKI (9)· patent assignee history
2012–2013Patents assigned to HIRANO ISAMU (2)· patent assignee history
2013–2018Based in Itoigawa, JP· patent location history
2016–2019Patents assigned to BROTHER IND LTD (2)· patent assignee history
2016–2019Based in Anpachi-gun, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HIGUCHI TAKAYUKIself | 9 | 2012–2014 |
| DENKI KAGAKU KOGYO KK | 8 | 2005–2014 |
| PANASONIC CORP | 7 | 2010–2014 |
| BROTHER IND LTD | 2 | 2016–2019 |
| HIRANO ISAMU | 2 | 2012–2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Osaka, JP | 7 | 2010–2014 |
| Itoigawa, JP | 4 | 2013–2018 |
| Tokyo, JP | 3 | 2007–2013 |
| Niigata, JP | 3 | 2005–2009 |
| Anpachi-gun, JP | 2 | 2016–2019 |