Inventor
DAVID GANI
Inventor
SG
Overview
Patents· 20 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices29%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1024%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1013%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation11%
G01JMeasurement of intensity, velocity, spectral content, polarisation, phase or pulse characteristics of infrared, visible or ultraviolet light5%
G01SRadio direction-finding5%
G01RMeasuring electric variables4%
H10DInorganic electric semiconductor devices4%
G06FElectric digital data processing2%
H01SDevices using the process of light amplification by stimulated emission of radiation [laser] to amplify or generate light2%
PatentTitleYear
12,557,694Semiconductor package with gas release holes202612,364,038Sensor die package202512,356,743Slanted glass edge for image sensor package202512,136,608Multi-chip package202411,996,397Wafer level proximity sensor202411,942,496Slanted glass edge for image sensor package202411,908,831Method for manufacturing a wafer level chip scale package (WLCSP)202411,828,875Proximity sensor with integrated ALS202311,742,437WLCSP with transparent substrate and method of manufacturing the same202311,585,847Crack detection integrity check202311,581,280WLCSP package with different solder volumes202311,581,289Multi-chip package202311,562,937Semiconductor package with protected sidewall and method of forming the same202311,527,511Electronic device comprising a support substrate and stacked electronic chips202211,502,029Thin semiconductor chip using a dummy sidewall layer202211,404,355Package with lead frame with improved lead design for discrete electrical components and manufacturing the same202211,366,156Crack detection integrity check202211,270,946Package with electrical interconnection bridge202211,226,399Proximity sensor with integrated ALS202211,193,821Ambient light sensor with light protection2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to ST MICROELECTRONICS PTE LTD (20)· patent assignee history
2021–2026Based in SG· patent location history
2022Patents assigned to ST MICROELECTRONICS GRENOBLE 2 (1)· patent assignee history
2022Patents assigned to ST MICROELECTRONICS INC (1)· patent assignee history
2022Patents assigned to ST MICROELECTRONICS ROUSSET (1)· patent assignee history
2023–2026Patents assigned to ST MICROELECTRONICS LTD (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ST MICROELECTRONICS PTE LTD | 20 | 2021–2026 |
| ST MICROELECTRONICS LTD | 3 | 2023–2026 |
| ST MICROELECTRONICS GRENOBLE 2 | 1 | 2022 |
| ST MICROELECTRONICS INC | 1 | 2022 |
| ST MICROELECTRONICS ROUSSET | 1 | 2022 |
Locations
| Location | Patents | Span |
|---|---|---|
| SG | 20 | 2021–2026 |