Inventor
Christopher W. Lattin
Inventor
Santa Cruz, CA, US
Overview
Patents· 3 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices27%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1027%
H05KPrinted circuits18%
B23KSoldering or unsoldering9%
B81BMicrostructural devices or systems, e.g. micromechanical devices9%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems9%
PatentTitleYear
10,325,877Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces20199,984,992Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces20189,530,749'Coupling of side surface contacts to a circuit platform'2016Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2016–2019Patents assigned to INVENSAS CORP (3)· patent assignee history
2016Based in San Jose, CA, US· patent location history
2018–2019Based in Santa Cruz, CA, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INVENSAS CORP | 3 | 2016–2019 |
Locations
| Location | Patents | Span |
|---|---|---|
| Santa Cruz, California, US | 2 | 2018–2019 |
| San Jose, California, US | 1 | 2016 |