Inventor
RUNG-JE YANG
Inventor
TW
Overview
Patents· 3 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1023%
C09GPolishing compositions15%
C09KMaterials for miscellaneous applications, not provided for elsewhere15%
H01LSemiconductor devices15%
B24BMachines, devices, or processes for grinding or polishing8%
G05BControl or regulating systems in general8%
G06NComputing arrangements based on specific computational models8%
G06QInformation and communication technology [ict] specially adapted for administrative, commercial, financial, managerial or supervisory purposes8%
PatentTitleYear
12,205,061Shared data induced quality control for a chemical mechanical planarization process202511,718,767Chemical mechanical planarization composition for polishing oxide materials and method of use thereof202311,401,441Chemical mechanical planarization (CMP) composition and methods therefore for copper and through silica via (TSV) applications2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to VERSUM MAT US LLC (3)· patent assignee history
2022Based in US· patent location history
2023–2025Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| VERSUM MAT US LLC | 3 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 2 | 2023–2025 |
| US | 1 | 2022 |