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Inventor

Tatsuro Sawatari

Inventor
Tokyo, JP

Overview

22→
Patents
2007–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 22 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H05Kprimary
H05KPrinted circuits38%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1030%
Y10TTechnical subjects covered by former us classification11%
H01LSemiconductor devices8%
H04NPictorial communication, e.g. television4%
Y02PClimate change mitigation technologies in the production or processing of goods4%
B05DProcesses for applying fluent materials to surfaces, in general2%
G03BApparatus or arrangements for taking photographs or for projecting or viewing them2%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation2%
PatentTitleYear
10,681,820Circuit board and manufacturing method therefor20209,818,780'Camera module'20179,363,897'Substrate with built-in electronic component'20169,301,407'Method of manufacturing substrate having cavity'20169,253,386'Camera module'20169,101,050'Circuit module having electrical shield'20159,101,075'Substrate with built-in component'20159,078,370'Substrate with built-in electronic component'20159,055,671'Substrate with built-in electronic component'20159,007,782'Substrate with built-in electronic component'20158,988,885'Electronic circuit module and method for producing the same'20158,964,407'Substrate with built-in electronic component'20158,923,009'Substrate with built-in electronic component'2014RE045146'Composite multi-layer substrate and module using the substrate'20148,811,021'Electronic circuit module'20148,314,343'Multi-layer board incorporating electronic component and method for producing the same'20127,928,560'Composite multi-layer substrate and module using the substrate'20117,745,926'Composite multi-layer substrate and module using the substrate'20107,738,256'Multilayer substrate including components therein'20107,379,306'Multilayer substrate including components therein'20087,348,662'Composite multi-layer substrate and module using the substrate'20087,278,205'Multilayer printed wiring board and production method therefor'2007

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2007–2020Patents assigned to TAIYO YUDEN KK (22)· patent assignee history
2007Based in Haruna, JP· patent location history
2008–2012Based in Takasaki, JP· patent location history
2008–2010Based in Gunma, JP· patent location history
2011–2014Based in Shimonoseki, JP· patent location history
2012–2015Patents assigned to INOUE YUSUKE (2)· patent assignee history
2012–2015Patents assigned to MIYAZAKI MASASHI (2)· patent assignee history
2012–2015Patents assigned to SAWATARI TATSURO (2)· patent assignee history
2012–2015Patents assigned to SUGIYAMA YUICHI (2)· patent assignee history
2014–2020Based in Tokyo, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TAIYO YUDEN KK222007–2020
INOUE YUSUKE22012–2015
MIYAZAKI MASASHI22012–2015
SAWATARI TATSUROself22012–2015
SUGIYAMA YUICHI22012–2015
Locations
LocationPatentsSpan
Tokyo, JP142014–2020
Takasaki, JP32008–2012
Shimonoseki, JP22011–2014
Gunma, JP22008–2010
Haruna, JP12007