Inventor

Ming-wei LIU

Inventor

Overview

4→

Patents

2023

Patent span

Performing operations

Primary field (CPC B)

Patents· 4 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B24Bprimary

B24BMachines, devices, or processes for grinding or polishing20%

B06BMethods or apparatus for generating or transmitting mechanical vibrations of infrasonic, sonic, or ultrasonic frequency, e.g. for performing mechanical work in general10%

B22FWorking metallic powder10%

B24CAbrasive or related blasting with particulate material10%

G01JMeasurement of intensity, velocity, spectral content, polarisation, phase or pulse characteristics of infrared, visible or ultraviolet light10%

H04JMultiplex communication10%

H04LTransmission of digital information, e.g. telegraphic communication10%

H04WWireless communication networks10%

Y02PClimate change mitigation technologies in the production or processing of goods10%

PatentTitleYear

11,768,112Insert coaxial thermal radiation image evaluating system2023 11,736,227Long-range modem scheme2023 11,633,824Grinding cavity body of multiple vibration sources2023 11,628,539Multi-dimensional vibration grinding cavity body2023

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2023Patents assigned to NAT CHUNG SHAN INST SCIENCE & TECH (3)· patent assignee history

2023Patents assigned to AMAZON TECH INC (1)· patent assignee history

2023Based in TW· patent location history

2023Based in US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
NAT CHUNG SHAN INST SCIENCE & TECH	3	2023
AMAZON TECH INC	1	2023

Locations

Location	Patents	Span
TW	3	2023
US	1	2023