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Inventor

Neng-An Kuo

Inventor
New Taipei, TW

Overview

5→
Patents
2009–2021
Patent span
LOC
Primary field

Patents· 5 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

LOC14primary
LOC1450%
G06FElectric digital data processing17%
H04LTransmission of digital information, e.g. telegraphic communication17%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1017%
PatentTitleYear
11,010,312Security system and method of stored data2021D0706263'Electronic device'2014D0689484'Electronic device'2013D0687433'Electronic device'20137,560,812'Cooling module against ESD and electronic package, assembly and system using the same'2009

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2009–2021Patents assigned to VIA TECH INC (5)· patent assignee history
2009Based in Taipei, TW· patent location history
2013Patents assigned to KUO NENG-AN (1)· patent assignee history
2013Patents assigned to LIN CHIA-YI (1)· patent assignee history
2013–2021Based in New Taipei, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
VIA TECH INC52009–2021
KUO NENG-ANself12013
LIN CHIA-YI12013
Locations
LocationPatentsSpan
New Taipei, TW42013–2021
Taipei, TW12009