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Inventor

Chih-Liang Chu

Inventor
Hsinchu, TW

Overview

2→
Patents
2005–2008
Patent span
Electricity
Primary field (CPC H)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H05Kprimary
H05KPrinted circuits50%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
PatentTitleYear
7,396,753'Semiconductor package substrate having bonding pads with plated layer thereon and process of manufacturing the same'20086,916,685'Method of plating metal layer over isolated pads on semiconductor package substrate'2005

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2005–2008Patents assigned to PHOENIX PREC TECHNOLOGY CORP (2)· patent assignee history
2005–2008Based in Hsinchu, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
PHOENIX PREC TECHNOLOGY CORP22005–2008
Locations
LocationPatentsSpan
Hsinchu, TW22005–2008