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Inventor

Xuefeng Lie

Inventor
South Burlington, VT, US

Overview

1→
Patents
2014
Patent span
Electricity
Primary field (CPC H)

Patents· 1 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices33%
H10DInorganic electric semiconductor devices33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
PatentTitleYear
8,872,281'Silicided trench contact to buried conductive layer'2014

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2014Patents assigned to COOLBAUGH DOUGLAS D (1)· patent assignee history
2014Patents assigned to IBM (1)· patent assignee history
2014Patents assigned to JOHNSON JEFFREY B (1)· patent assignee history
2014Patents assigned to LIE XUEFENG (1)· patent assignee history
2014Patents assigned to LINDGREN PETER J (1)· patent assignee history
2014Based in South Burlington, VT, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
COOLBAUGH DOUGLAS D12014
IBM12014
JOHNSON JEFFREY B12014
LIE XUEFENGself12014
LINDGREN PETER J12014
Locations
LocationPatentsSpan
South Burlington, VT, US12014