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Inventor

Yan-Zuo Tsai

Inventor
Hsinchu, TW

Overview

3→
Patents
2019–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices33%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1033%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
PatentTitleYear
10,867,831Method and apparatus for bonding semiconductor devices202010,748,803Method and apparatus for bonding semiconductor devices202010,269,611Method and apparatus for bonding semiconductor devices2019

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2019–2020Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (3)· patent assignee history
2019–2020Based in Hsinchu, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TAIWAN SEMICONDUCTOR MFG CO LTD32019–2020
Locations
LocationPatentsSpan
Hsinchu, TW32019–2020