Inventor
Pasi Raappana
Inventor
Kempele, FI
Overview
Patents· 14 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits33%
B29CShaping or joining of plastics23%
B29LIndexing scheme associated with subclass b29c, relating to particular articles23%
G06FElectric digital data processing8%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form5%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h105%
H01LSemiconductor devices3%
H01RElectrically-conductive connections3%
PatentTitleYear
10,986,735Method for manufacturing an electromechanical structure and an arrangement for carrying out the method202110,986,733Method for manufacturing an electromechanical structure202110,986,734Method for manufacturing an electromechanical structure and an arrangement for carrying out the method202110,813,222System for manufacturing an electromechanical structure202010,660,211Method for manufacturing an electromechanical structure202010,642,433Multilayer structure with embedded multilayer electronics202010,645,796Electrical node, method for manufacturing electrical node and multilayer structure comprising electrical node202010,575,407System for carrying out a manufacturing method on an electro chemical structure202010,285,261Electrical node, method for manufacturing an electrical node, electrical node strip or sheet, and multilayer structure comprising the node201910,248,277Multilayer structure with embedded multilayer electronics201910,225,932Interfacing arrangement, method for manufacturing an interfacing arrangement, and multilayer structure hosting an interfacing arrangement201910,194,526Electrical node, method for manufacturing an electrical node, electrical node strip or sheet, and multilayer structure comprising the node20199,801,286'Multilayer structure and related method of manufacture for electronics'20179,724,869'Multilayer structure for accommodating electronics and related method of manufacture'2017Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2017–2021Patents assigned to TACTOTEK OY (13)· patent assignee history
2017Patents assigned to TACTO TEK OY (1)· patent assignee history
2017–2021Based in Kempele, FI· patent location history
2019–2020Based in Oulunsalo, FI· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TACTOTEK OY | 13 | 2017–2021 |
| TACTO TEK OY | 1 | 2017 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kempele, FI | 8 | 2017–2021 |
| Oulunsalo, FI | 6 | 2019–2020 |