Inventor

Michel Koopmans

Inventor

Boise, ID, US

Overview

32→

Patents

2003–2021

Patent span

Electricity

Primary field (CPC H)

Patents· 32 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1031%

H01LSemiconductor devices27%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1015%

G11CStatic stores5%

H05KPrinted circuits5%

H10BElectronic memory devices5%

B23KSoldering or unsoldering4%

G01RMeasuring electric variables4%

Y10TTechnical subjects covered by former us classification3%

PatentTitleYear

11,004,494Memory arrays, and methods of forming memory arrays2021 10,651,155Thermal pads between stacked semiconductor dies and associated systems and methods2020 10,481,200Semiconductor device test apparatuses comprising at least one test site having an array of pockets2019 10,461,059Stacked semiconductor die assemblies with improved thermal performance and associated systems and methods2019 10,269,782Apparatuses and methods for forming die stacks2019 10,242,726Memory arrays, and methods of forming memory arrays2019 10,153,027Memory arrays, and methods of forming memory arrays2018 10,126,357Methods of testing semiconductor devices comprising a die stack having protruding conductive elements2018 10,096,579Thermal pads between stacked semiconductor dies and associated systems and methods2018 10,083,734Memory arrays2018 10,062,679Apparatuses and methods for forming die stacks2018 9,881,910'Apparatuses and methods for forming die stacks'2018 9,818,625'Stacked semiconductor die assemblies with thermal spacers and associated systems and methods'2017 9,768,147'Thermal pads between stacked semiconductor dies and associated systems and methods'2017 9,733,304'Semiconductor device test apparatuses'2017 9,711,494'Methods of fabricating semiconductor die assemblies'2017 9,659,917'Apparatuses and methods for forming die stacks'2017 9,379,091'Semiconductor die assemblies and semiconductor devices including same'2016 9,362,143'Methods for forming semiconductor device packages with photoimageable dielectric adhesive material, and related semiconductor device packages'2016 9,287,240'Stacked semiconductor die assemblies with thermal spacers and associated systems and methods'2016 9,269,700'Stacked semiconductor die assemblies with improved thermal performance and associated systems and methods'2016 8,937,309'Semiconductor die assemblies, semiconductor devices including same, and methods of fabrication'2015 8,828,798'Semiconductor die assemblies, semiconductor devices including same, and methods of fabrication'2014 8,552,567'Semiconductor die assemblies, semiconductor devices including same, and methods of fabrication'2013 7,637,412'Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece'2009 7,347,348'Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece'2008 6,943,094'Method for attaching semiconductor components to a substrate using component attach system having radiation exposure assembly'2005 6,911,624'Component installation, removal, and replacement apparatus and method'2005 6,845,901'Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece'2005 6,847,105'Bumping technology in stacked die configurations'2005 6,706,557'Method of fabricating stacked die configurations utilizing redistribution bond pads'2004 6,589,809'Method for attaching semiconductor components to a substrate using local UV curing of dicing tape'2003

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2003–2021Patents assigned to MICRON TECHNOLOGY INC (32)· patent assignee history

2003–2021Based in Boise, ID, US· patent location history

2013–2016Patents assigned to KOOPMANS MICHEL (3)· patent assignee history

2013–2015Patents assigned to ENGLAND LUKE G (2)· patent assignee history

2013–2015Patents assigned to SILVESTRI PAUL A (2)· patent assignee history

2016Patents assigned to GANDHI JASPREET S (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
MICRON TECHNOLOGY INC	32	2003–2021
KOOPMANS MICHELself	3	2013–2016
ENGLAND LUKE G	2	2013–2015
SILVESTRI PAUL A	2	2013–2015
GANDHI JASPREET S	1	2016

Locations

Location	Patents	Span
Boise, ID, US	32	2003–2021