Inventor
FU-JIER FAN
Inventor
TW
Overview
Patents· 11 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices39%
H10DInorganic electric semiconductor devices29%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1029%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h104%
PatentTitleYear
12,500,193Semiconductor device202512,414,361Method of manufacturing a semiconductor device202512,272,686Semiconductor structure and manufacturing method of the same202512,100,706Semiconductor structure and method of forming thereof202411,710,712Semiconductor device and manufacturing method of the same202311,705,449Through silicon via design for stacking integrated circuits202311,646,308Through silicon via design for stacking integrated circuits202311,569,363Dishing prevention dummy structures for semiconductor devices202311,417,649Semiconductor device202211,410,995Semiconductor structure and method of forming thereof202211,302,691High voltage integration for HKMG technology2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (11)· patent assignee history
2022–2025Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 11 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 11 | 2022–2025 |