Inventor
Paul F. Fortier
Inventor
Richelieu, CA
Overview
Patents· 49 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G02Bprimary
G02BOptical elements, systems or apparatus40%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1015%
H01LSemiconductor devices6%
Y10TTechnical subjects covered by former us classification6%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation5%
B29CShaping or joining of plastics4%
H04BTransmission4%
B29DProducing particular articles from plastics or from substances in a plastic state2%
B29LIndexing scheme associated with subclass b29c, relating to particular articles2%
F21VFunctional features or details of lighting devices or systems thereof2%
PatentTitleYear
10,969,222Measurements of an integrated circuit chip and connected chip carrier to estimate height of interconnect202110,754,070Microlens array assembling process202010,690,867Optical device with adhesive connection of recess or side protrusion202010,613,282Fluid control structure202010,539,743Fiber attach assembly and test automation202010,371,907Fluid control structure201910,338,325Nanofiller in an optical interface201910,302,869Optical interconnect attach to photonic device with partitioning adhesive function201910,295,749Optical interconnect attach to photonic device with partitioning adhesive function201910,128,590Pluggable LGA socket for high density interconnects201810,073,223Connecting mid-board optical modules20189,989,713Fluid control structure20189,958,625Structured substrate for optical fiber alignment20189,897,444'Measurements of an integrated circuit chip and connected chip carrier to estimate height of interconnect'20189,835,804Connecting mid-board optical modules20179,810,864'Fiber pigtail assembly with integrated lid enabling optical fiber mobility'20179,759,868'Structures for preventing dicing damage'20179,720,188'Connecting mid-board optical modules'20179,706,670'Connecting mid-board electronic devices'20179,701,872'Picktip having non-planar topography'20179,684,133'Component assembly apparatus'20179,671,578'Structured substrate for optical fiber alignment'20179,662,830'Bondline control fixture and method of affixing first and second components'20179,656,420'Bondline control fixture and method of affixing first and second components'20179,658,415'Structured substrate for optical fiber alignment'20179,651,747'Fiber pigtail assembly with integrated lid enabling optical fiber mobility'20179,577,361'Pluggable LGA socket for high density interconnects'20179,568,682'Component and chip assembly structure for high yield parallelized fiber assembly'20179,400,356'Fiber pigtail with integrated lid'20169,393,633'Method of joining a chip on a substrate'20169,360,644'Laser die and photonics die package'20169,316,796'Fiber pigtail with integrated lid'20169,293,439'Electronic module assembly with patterned adhesive array'20169,243,784'Semiconductor photonic package'20169,246,592'Structured substrate for optical fiber alignment'20169,206,965'Semiconductor photonic package'20159,093,563'Electronic module assembly with patterned adhesive array'20158,559,474'Silicon carrier optoelectronic packaging'20138,483,253'3D optoelectronic packaging'20138,411,719'3D optoelectronic packaging'20138,290,008'Silicon carrier optoelectronic packaging'20128,198,133'Structures and methods to improve lead-free C4 interconnect reliability'20128,111,730'3D optoelectronic packaging'20126,822,875'Assembly of opto-electronic module with improved heat sink'20046,712,527'Fiber optic connections and method for using same'20046,652,159'Enhanced optical transceiver arrangement'20036,547,452'Alignment systems for subassemblies of overmolded optoelectronic modules'20036,516,129'Processing protective plug insert for optical modules'20036,508,595'Assembly of opto-electronic module with improved heat sink'2003Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2003–2021Patents assigned to IBM (46)· patent assignee history
2003–2021Based in Richelieu, CA· patent location history
2012–2013Patents assigned to FORTIER PAUL (6)· patent assignee history
2012–2013Patents assigned to BUDD RUSSELL A (5)· patent assignee history
2012–2013Patents assigned to LIBSCH FRANK R (4)· patent assignee history
2012–2020Based in Bromont, CA· patent location history
2012Based in Yorktown Heights, NY, US· patent location history
2013–2019Based in Quebec, CA· patent location history
2017–2018Patents assigned to US CONEC LTD (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 46 | 2003–2021 |
| FORTIER PAULself | 6 | 2012–2013 |
| BUDD RUSSELL A | 5 | 2012–2013 |
| LIBSCH FRANK R | 4 | 2012–2013 |
| US CONEC LTD | 3 | 2017–2018 |
Locations
| Location | Patents | Span |
|---|---|---|
| Richelieu, CA | 27 | 2003–2021 |
| Quebec, CA | 15 | 2013–2019 |
| Bromont, CA | 6 | 2012–2020 |
| Yorktown Heights, New York, US | 1 | 2012 |