Inventor
Toshio Hatsuda
Inventor
Ibaraki, JP
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1086%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests14%
PatentTitleYear
RE037690'Lead frame and semiconductor device'20025,365,400'Heat sinks and semiconductor cooling device using the heat sinks'19945,276,586'Bonding structure of thermal conductive members for a multi-chip module'19945,270,572'Liquid impingement cooling module for semiconductor devices'19935,089,936'Semiconductor module'19924,942,452'Lead frame and semiconductor device'1990Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1990–2002Patents assigned to HITACHI LTD (6)· patent assignee history
1990–1994Based in Ibaraki, JP· patent location history
2002Based in Niihari-gun, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HITACHI LTD | 6 | 1990–2002 |
Locations
| Location | Patents | Span |
|---|---|---|
| Ibaraki, JP | 5 | 1990–1994 |
| Niihari-gun, JP | 1 | 2002 |