Inventor
Doo Hyun Park
Inventor
Gyeonggi-do, KR
Overview
Patents· 48 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H01LSemiconductor devices27%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1015%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution5%
H01MProcesses or means, e.g. batteries, for the direct conversion of chemical energy into electrical energy3%
C12QMeasuring or testing processes involving enzymes, nucleic acids or microorganisms2%
Y02PClimate change mitigation technologies in the production or processing of goods2%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests2%
C02FTreatment of water, waste water, sewage, or sludge2%
C12PFermentation or enzyme-using processes to synthesise a desired chemical compound or composition or to separate optical isomers from a racemic mixture2%
PatentTitleYear
10,707,181Semiconductor device with redistribution layers formed utilizing dummy substrates202010,679,952Semiconductor device having an encapsulated front side and interposer and manufacturing method thereof202010,672,699Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers202010,535,536Stiffener package and method of fabricating stiffener package202010,515,825Semiconductor device and manufacturing method thereof201910,388,643Semiconductor device using EMC wafer support system and fabricating method thereof201910,297,466Semiconductor device and manufacturing method thereof201910,224,217Wafer level fan out package and method of fabricating wafer level fan out package201910,199,322Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers201910,163,855Semiconductor device and manufacturing method thereof201810,090,185Semiconductor device and manufacturing method thereof201810,079,157Semiconductor device and manufacturing method thereof201810,032,740Semiconductor device and manufacturing method thereof20189,966,276Semiconductor device and manufacturing method thereof20189,818,721'Semiconductor device and manufacturing method thereof'20179,818,685'Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers'20179,793,180'Semiconductor device and manufacturing method thereof'20179,728,514'Semiconductor device and manufacturing method thereof'20179,711,484'Semiconductor package with semiconductor die directly attached to lead frame and method'20179,627,368'Semiconductor device using EMC wafer support system and fabricating method thereof'20179,627,353'Method of manufacturing a semiconductor package'20179,536,858'Semiconductor device and manufacturing method thereof'20179,502,375'Semiconductor device with plated pillars and leads'20169,484,331'Semiconductor device and manufacturing method thereof'20169,478,517'Electronic device package structure and method of fabricating the same'20169,437,575'Semiconductor device package formed in a chip-on-wafer last process using thin film adhesives'20169,418,922'Semiconductor device with reduced thickness'20169,406,638'Semiconductor device and manufacturing method thereof'20169,391,043'Semiconductor device and manufacturing method thereof'20169,219,042'Semiconductor device and manufacturing method thereof'20159,214,434'Fan-out semiconductor package'20159,196,601'Semiconductor device'20159,190,370'Semiconductor device utilizing redistribution layers to couple stacked die'20159,048,241'Semiconductor device utilzing redistribution layers to couple stacked die'20159,048,125'Semiconductor device and manufacturing method thereof'20159,000,586'Semiconductor device and manufacturing method thereof'20158,552,556'Wafer level fan out package'20138,227,921'Semiconductor package with increased I/O density and method of making same'20128,089,159'Semiconductor package with increased I/O density and method of making the same'20127,902,660'Substrate for semiconductor device and manufacturing method thereof'20117,838,282'Electrode compositions and configurations for electrochemical bioreactor systems'20107,250,288'Electrode compositions and configurations for electrochemical bioreactor systems'20077,202,554'Semiconductor package and its manufacturing method'20077,030,508'Substrate for semiconductor package and wire bonding method using thereof'20066,822,323'Semiconductor package having more reliable electrical conductive patterns'20046,270,649'Electrochemical methods for generation of a biological proton motive force and pyridine nucleotide cofactor regeneration'20015,976,719'Mediator-less biofuel cell'19995,661,338'Chip mounting plate construction of lead frame for semiconductor package'1997Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1999–2010Based in Seoul, KR· patent location history
2001–2010Patents assigned to UNIV MICHIGAN STATE (3)· patent assignee history
2004–2020Patents assigned to AMKOR TECHNOLOGY INC (43)· patent assignee history
2011–2020Based in Gyeonggi-do, KR· patent location history
2012–2015Patents assigned to PARK DOO HYUN (6)· patent assignee history
2015Patents assigned to PAEK JONG SIK (3)· patent assignee history
2015Patents assigned to DO WON CHUL (2)· patent assignee history
2016–2020Based in Seongnam-si, KR· patent location history
2017–2019Based in Anyang-si, KR· patent location history
2019–2020Based in Gwangju-si, KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| AMKOR TECHNOLOGY INC | 43 | 2004–2020 |
| PARK DOO HYUNself | 6 | 2012–2015 |
| PAEK JONG SIK | 3 | 2015 |
| UNIV MICHIGAN STATE | 3 | 2001–2010 |
| DO WON CHUL | 2 | 2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Gyeonggi-do, KR | 23 | 2011–2020 |
| Seongnam-si, KR | 7 | 2016–2020 |
| Seoul, KR | 6 | 1999–2010 |
| Anyang-si, KR | 4 | 2017–2019 |
| Gwangju-si, KR | 2 | 2019–2020 |