Inventor

Ching-Wen Chiang

Inventor

Taichung, TW

Overview

19→

Patents

2015–2020

Patent span

Electricity

Primary field (CPC H)

Patents· 19 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary

H01LSemiconductor devices30%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1030%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1015%

H01QAntennas, i.e. radio aerials6%

H03FAmplifiers6%

Y02DClimate change mitigation technologies in information and communication technologies [ict], i.e. information and communication technologies aiming at the reduction of their own energy use4%

H01FMagnets2%

H03DDemodulation or transference of modulation from one carrier to another2%

H03HImpedance networks, e.g. resonant circuits2%

H04BTransmission2%

PatentTitleYear

10,707,835Wireless receiving device2020 10,566,299Method for manufacturing a multi-band antenna package structure2020 10,424,550Multi-band antenna package structure, manufacturing method thereof and communication device2019 10,361,154Variable inductor and integrated circuit using the variable inductor2019 10,298,182Radio frequency amplifier and integrated circuit using the radio frequency amplifier2019 10,277,170Radio frequency amplifier and integrated circuit using the radio frequency amplifier2019 10,249,562Package structure and fabrication method thereof2019 10,236,227Electronic package and fabrication method thereof2019 10,199,320Method of fabricating electronic package2019 10,199,345Method of fabricating substrate structure2019 10,096,541Method for fabricating electronic package2018 10,096,558Multi-band antenna package structure, manufacturing method thereof and communication device2018 10,049,973Electronic package and fabrication method thereof and substrate structure2018 9,899,344'Substrate structure, fabrication method thereof and conductive structure'2018 9,818,683'Electronic package and method of fabricating the same'2017 9,754,868'Substrate structure, electronic package and method for fabricating the electronic package'2017 9,748,183'Fabrication method of semiconductor package'2017 9,627,307'Semiconductor package and fabrication method thereof'2017 9,196,596'Interposer and method of manufacturing the same'2015

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2015–2019Patents assigned to SILICONWARE PRECISION INDUSTRIES CO LTD (12)· patent assignee history

2015–2019Based in Taichung, TW· patent location history

2018–2020Patents assigned to NAT CHUNG SHAN INST SCIENCE & TECH (6)· patent assignee history

2018–2020Based in Chiayi, TW· patent location history

2019Patents assigned to SILICONWARE PRESCISION IND CO LTD (1)· patent assignee history

2020Patents assigned to IND TECH RES INST (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
SILICONWARE PRECISION INDUSTRIES CO LTD	12	2015–2019
NAT CHUNG SHAN INST SCIENCE & TECH	6	2018–2020
IND TECH RES INST	1	2020
SILICONWARE PRESCISION IND CO LTD	1	2019

Locations

Location	Patents	Span
Taichung, TW	12	2015–2019
Chiayi, TW	7	2018–2020