Inventor
HUNG YEN
Inventor
TW
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices22%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1022%
B24BMachines, devices, or processes for grinding or polishing17%
C09GPolishing compositions17%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1017%
C09KMaterials for miscellaneous applications, not provided for elsewhere6%
PatentTitleYear
12,002,684Methods for chemical mechanical polishing and forming interconnect structure202411,772,228Chemical mechanical polishing apparatus including a multi-zone platen202311,658,065Chemical mechanical polishing slurry composition, method for chemical mechanical polishing and method for forming connecting structure202311,508,585Methods for chemical mechanical polishing and forming interconnect structure2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2024Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (4)· patent assignee history
2022–2024Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 4 | 2022–2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 4 | 2022–2024 |