Inventor
Yoichi Oya
Inventor
Kanagawa, JP
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H03HImpedance networks, e.g. resonant circuits13%
Y10TTechnical subjects covered by former us classification13%
Y02PClimate change mitigation technologies in the production or processing of goods7%
PatentTitleYear
7,192,801'Printed circuit board and fabrication method thereof'20076,949,836'Printed circuit board multi-layer structure with embedded device'20056,797,890'High frequency module device and method for its preparation'20046,714,422'High frequency module device and method for its preparation'20046,469,393'Semiconductor package and mount board'2002Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2002–2007Patents assigned to SONY CORP (5)· patent assignee history
2002Based in Chiba, JP· patent location history
2004–2007Based in Kanagawa, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SONY CORP | 5 | 2002–2007 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kanagawa, JP | 4 | 2004–2007 |
| Chiba, JP | 1 | 2002 |