Inventor
Robert N. Jarrett
Inventor
Utica, NY, US
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H01LSemiconductor devices28%
H10HInorganic light-emitting semiconductor devices having potential barriers17%
G01KMeasuring temperature6%
G01RMeasuring electric variables6%
H05KPrinted circuits6%
Y10TTechnical subjects covered by former us classification6%
PatentTitleYear
10,943,795Apparatus and methods for creating a thermal interface bond between a semiconductor die and a passive heat exchanger202110,943,796Semiconductor device assembly having a thermal interface bond between a semiconductor die and a passive heat exchanger202110,838,002Burn-in preform and method of making the same202010,607,857Semiconductor device assembly including a thermal interface bond between a semiconductor die and a passive heat exchanger20209,468,136'Low void solder joint for multiple reflow applications'20167,593,228'Technique for forming a thermally conductive interface with patterned metal foil'2009Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2009Patents assigned to INDIUM CORP AMERICA (1)· patent assignee history
2009–2016Based in Clinton, NY, US· patent location history
2016–2021Patents assigned to INDIUM CORP (5)· patent assignee history
2020–2021Based in Utica, NY, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INDIUM CORP | 5 | 2016–2021 |
| INDIUM CORP AMERICA | 1 | 2009 |
Locations
| Location | Patents | Span |
|---|---|---|
| Utica, New York, US | 4 | 2020–2021 |
| Clinton, New York, US | 2 | 2009–2016 |