Inventor

Haruhiko Matsuyama

Inventor

Hiratsuka, JP

Overview

17→

Patents

1984–2000

Patent span

Electricity

Primary field (CPC H)

Patents· 17 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

Y10Tprimary

Y10TTechnical subjects covered by former us classification20%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1017%

H05KPrinted circuits13%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests11%

C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds9%

G11BInformation storage based on relative movement between record carrier and transducer7%

H01BCables4%

H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation4%

Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution4%

C07FAcyclic, carbocyclic or heterocyclic compounds containing elements other than carbon, hydrogen, halogen, oxygen, nitrogen, sulfur, selenium or tellurium2%

PatentTitleYear

6,132,852'Multilayer wiring substrate and method for production thereof'2000 6,124,553'Multilayer wiring board having vent holes and method of making'2000 5,970,310'Method for manufacturing multilayer wiring board and wiring pattern forming apparatus'1999 5,958,600'Circuit board and method of manufacturing the same'1999 5,868,949'Metalization structure and manufacturing method thereof'1999 5,851,681'Wiring structure with metal wiring layers and polyimide layers, and fabrication process of multilayer wiring board'1998 5,753,372'Wiring structures and method of manufacturing the same'1998 5,388,328'Process for fabricating an interconnected multilayer board'1995 5,300,735'Interconnected multilayer boards and fabrication processes thereof'1994 5,280,102'Heat-resistant bonding materials'1994 5,208,656'Multilayer wiring substrate and production thereof'1993 4,824,731'Thin film magnetic head'1989 4,772,505'Magnetic bubble memory element'1988 4,748,228'Process for producing organic silicon-terminated polyimide precursor and polyimide'1988 4,686,147'Magnetic head and method of producing the same'1987 4,643,913'Process for producing solar cells'1987 4,486,232'Electrode material for semi-conductor devices'1984

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1984–2000Patents assigned to HITACHI LTD (17)· patent assignee history

1984–2000Based in Hiratsuka, JP· patent location history

1988–1994Patents assigned to HITACHI CHEMICAL CO LTD (2)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
HITACHI LTD	17	1984–2000
HITACHI CHEMICAL CO LTD	2	1988–1994

Locations

Location	Patents	Span
Hiratsuka, JP	17	1984–2000