Inventor
STEVEN M. ZUNIGA
Inventor
US
Overview
Patents· 48 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B24Bprimary
B24BMachines, devices, or processes for grinding or polishing40%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1030%
H01LSemiconductor devices17%
B08BCleaning in general4%
Y10TTechnical subjects covered by former us classification4%
A46BBrushes1%
B23BTurning1%
B24DTools for grinding, buffing or sharpening1%
B26DCutting1%
C23FNon-mechanical removal of metallic material from surface1%
PatentTitleYear
12,515,296Polishing carrier head with floating edge control202612,447,579Chemical mechanical polishing vibration measurement using optical sensor202512,434,348Retaining ring having inner surfaces with features202512,400,892High throughput polishing modules and modular polishing systems202512,394,651High throughput polishing modules and modular polishing systems202512,365,060Chemical mechanical polishing correction tool202512,337,439Multiple disk pad conditioner202512,330,262Dual membrane carrier head for chemical mechanical polishing202512,251,788Polishing head with local wafer pressure202512,251,787Modular chemical mechanical polisher with simultaneous polishing and pad treatment202512,214,469Polishing head retaining ring tilting moment control202512,198,944Substrate handling in a modular polishing system with single substrate cleaning chambers202512,194,591Roller for location-specific wafer polishing202512,142,513Wafer processing tools and methods thereof202412,128,524Membrane for carrier head with segmented substrate chuck202412,076,877Polishing platens and polishing platen manufacturing methods202412,048,981Retaining ring having inner surfaces with features202412,042,899Polishing head with membrane position control202412,033,865Retaining ring having inner surfaces with facets202411,986,923Polishing head with local wafer pressure202411,958,164Stepped retaining ring202411,945,073Dual membrane carrier head for chemical mechanical polishing202411,931,857Deformable substrate chuck202411,919,120Polishing system with contactless platen edge control202411,904,429Substrate polishing apparatus with contact extension or adjustable stop202411,890,717Polishing system with platen for substrate edge control202411,850,703Method of forming retaining ring with shaped surface202311,780,046Polishing system with annular platen or polishing pad202311,780,049Polishing carrier head with multiple angular pressurizable zones202311,759,911Carrier head with segmented substrate chuck202311,745,227Substrate cleaning devices and methods thereof202311,749,552Wafer processing tools and methods thereof202311,724,357Pivotable substrate retaining ring202311,717,936Methods for a web-based CMP system202311,721,563Non-contact clean module202311,682,561Retaining ring having inner surfaces with facets202311,660,721Dual loading retaining ring202311,623,321Polishing head retaining ring tilting moment control202311,577,361Retaining ring with shaped surface and method of forming202311,511,390Pivotable substrate retaining ring202211,511,388Polishing system with support post and annular platen or polishing pad202211,453,099Retaining ring having inner surfaces with features202211,400,560Retaining ring design202211,389,925Offset head-spindle for chemical mechanical polishing202211,344,991Retainer for chemical mechanical polishing carrier head202211,325,223Carrier head with segmented substrate chuck202211,289,347Non-contact clean module202211,260,500Retaining ring with shaped surface2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to APPLIED MATERIALS INC (48)· patent assignee history
2022–2026Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| APPLIED MATERIALS INC | 48 | 2022–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 48 | 2022–2026 |