Inventor
Tsing-Fong Hwang
Inventor
Tainan, TW
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1083%
H10DInorganic electric semiconductor devices17%
PatentTitleYear
6,940,146'Interconnect structure with an enlarged air gaps disposed between conductive structures or surrounding a conductive structure within the same'20056,914,318'Interconnect structure with an enlarged air gaps disposed between conductive structures or surrounding a conductive structure within the same'20056,888,247'Interconnect structure with an enlarged air gaps disposed between conductive structures or surrounding a conductive structure within the same'20056,380,073'Method for forming metal interconnection structure without corner faceted'20026,211,048'Method of reducing salicide lateral growth'20016,077,767'Modified implementation of air-gap low-K dielectric for unlanded via'2000Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2000–2005Patents assigned to UNITED MICROELECTRONICS CORP (6)· patent assignee history
2000Patents assigned to UNITED SEMICONDUCTOR CORP (1)· patent assignee history
2000–2005Based in Tainan, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| UNITED MICROELECTRONICS CORP | 6 | 2000–2005 |
| UNITED SEMICONDUCTOR CORP | 1 | 2000 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tainan, TW | 6 | 2000–2005 |