Inventor
PO-YUAN TENG
Inventor
TW
Overview
Patents· 26 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices32%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1032%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1025%
H05KPrinted circuits5%
H10BElectronic memory devices2%
H10DInorganic electric semiconductor devices2%
G02BOptical elements, systems or apparatus1%
PatentTitleYear
12,566,302Package structure and method of forming the same202612,525,501Semiconductor device202612,489,064Method for forming mark, packaging method of semiconductor device, and semiconductor device having the mark202512,406,961Integrated circuit package and method202512,374,592Semiconductor device and manufacturing method thereof202512,300,618Semiconductor device having a heat dissipation structure connected chip package202512,205,923Semiconductor device, circuit board structure and manufacturing method thereof202512,166,015Semiconductor package and manufacturing method of semiconductor package202412,057,405Packages with thick RDLs and thin RDLs stacked alternatingly202412,051,666Package structure and manufacturing method of package structure thereof202412,014,976Chip package structure including a silicon substrate interposer and methods for forming the same202412,009,281Package structure and method of manufacturing the same202411,990,381Integrated circuit packages having support rings202411,848,233Semiconductor package and manufacturing method thereof202311,694,943Semiconductor device including heat dissipation structure and fabricating method of the same202311,646,296Semiconductor package and manufacturing method of semiconductor package202311,646,255Chip package structure including a silicon substrate interposer and methods for forming the same202311,569,202Semiconductor device, circuit board structure and manufacturing method thereof202311,508,665Packages with thick RDLs and thin RDLs stacked alternatingly202211,508,671Semiconductor package and manufacturing method thereof202211,502,013Integrated circuit package and method202211,355,466Package structure and manufacturing method of package structure thereof202211,289,373Semiconductor package and manufacturing method thereof202211,282,791Semiconductor device having a heat dissipation structure connected chip package202211,239,135Package structure and method of manufacturing the same202211,177,192Semiconductor device including heat dissipation structure and fabricating method of the same2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (26)· patent assignee history
2021–2026Based in TW· patent location history
2025Patents assigned to TAIWAN SEMICONDUCTOR MFG LTD (1)· patent assignee history
2025Patents assigned to TAIWNA SEMICONDUCTOR MFG COMPANY LTD (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 26 | 2021–2026 |
| TAIWAN SEMICONDUCTOR MFG LTD | 1 | 2025 |
| TAIWNA SEMICONDUCTOR MFG COMPANY LTD | 1 | 2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 26 | 2021–2026 |