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Inventor

Hong Li

Inventor
Boise, ID, US

Overview

3→
Patents
2015–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices29%
H10BElectronic memory devices29%
H10DInorganic electric semiconductor devices29%
G06FElectric digital data processing14%
PatentTitleYear
10,998,440Device including a vertical transistor having a large band gap channel material and void spaces adjacent gate electrodes, and related methods and systems202110,886,282Integrated assemblies, and methods of forming integrated assemblies20218,972,942'Unit testing an Enterprise Javabeans (EJB) bean class'2015

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2015Patents assigned to GU GENG XIAN (1)· patent assignee history
2015Patents assigned to IBM (1)· patent assignee history
2015Patents assigned to LI HAI DONG (1)· patent assignee history
2015Based in Shanghai, CN· patent location history
2021Patents assigned to MICRON TECHNOLOGY INC (2)· patent assignee history
2021Based in Boise, ID, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
MICRON TECHNOLOGY INC22021
GU GENG XIAN12015
IBM12015
LI HAI DONGself12015
Locations
LocationPatentsSpan
Boise, ID, US22021
Shanghai, CN12015