Inventor
Shunichi Kikuchi
Inventor
Kawasaki, JP
Overview
Patents· 23 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H05KPrinted circuits18%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application7%
G06KGraphical data reading7%
Y10TTechnical subjects covered by former us classification7%
G11BInformation storage based on relative movement between record carrier and transducer5%
B31DMaking articles of paper, cardboard or material worked in a manner analogous to paper, not provided for in subclasses b31b or b31c3%
F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact3%
G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein3%
G06FElectric digital data processing3%
PatentTitleYear
10,443,957Cooling plate and information processing device201910,108,235Information processing apparatus and heat exchanger20189,642,287'Cooling plate and data processing system provided with cooling plates'20177,951,249'RFID tag'20117,431,218'RFID tag, module component, and RFID tag fabrication method'20087,214,563'IC chip mounting method'20077,199,718'RFID tag with thermal conductive cover'20076,891,247'Semiconductor device including semiconductor bare chip mounted by flip-chip bonding, and board member with thin-film structure capacitor for semiconductor bare chip mounted by flip-chip bonding'20056,787,711'Printed wiring board device having heat-absorbing dummy parts, and method of manufacturing the printed wiring board device'20046,465,085'Thin film wiring board and method for manufacturing the same, base substrate and method for manufacturing the same'20026,399,897'Multi-layer wiring substrate'20026,303,877'Multilayer thin-film wiring board'20016,300,678'I/O pin having solder dam for connecting substrates'20016,054,652'Thin-film multi-layer substrate and electronic device'20005,894,882'Heat sink structure for cooling a substrate and an electronic apparatus having such a heat sink structure'19995,763,950'Semiconductor element cooling apparatus'19985,586,006'Multi-chip module having a multi-layer circuit board with insulating layers and wiring conductors stacked together'19965,126,919'Cooling system for an electronic circuit device'19925,050,037'Liquid-cooling module system for electronic circuit components'19914,920,574'Cooling system for an electronic circuit device'19904,879,632'Cooling system for an electronic circuit device'19894,783,721'Cooling system for an electronic circuit device'19884,712,158'Cooling system for electronic circuit components'1987Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1987–2019Patents assigned to FUJITSU LTD (22)· patent assignee history
1987–2019Based in Yokohama, JP· patent location history
1996–2011Based in Kawasaki, JP· patent location history
2007Patents assigned to FUJITSU FRONTECH LTD (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| FUJITSU LTD | 22 | 1987–2019 |
| FUJITSU FRONTECH LTD | 1 | 2007 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kawasaki, JP | 14 | 1996–2011 |
| Yokohama, JP | 9 | 1987–2019 |