Inventor
Gary Yasumura
Inventor
Santa Clara, CA, US
Overview
Patents· 26 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Rprimary
H01RElectrically-conductive connections40%
H05KPrinted circuits32%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h109%
G01RMeasuring electric variables6%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests6%
H01PWaveguides4%
G02BOptical elements, systems or apparatus2%
H03DDemodulation or transference of modulation from one carrier to another2%
PatentTitleYear
8,313,333'Connector having a housing with a conductor with a ramp section and a curved surface section'20128,079,848'Electrical connector with conductors with a ramp to induce torsion'20117,973,391'Tapered dielectric and conductor structures and applications thereof'20117,909,615'Torsionally-induced contact-force conductors for electrical connector systems'20117,845,986'Torsionally-induced contact-force conductors for electrical connector systems'20107,750,446'IC package structures having separate circuit interconnection structures and assemblies constructed thereof'20107,651,336'High speed, direct path, stair-step, electronic connectors with improved signal integrity characteristics and methods for their manufacture'20107,652,381'Interconnect system without through-holes'20107,651,382'Electrical interconnection devices incorporating redundant contact points for reducing capacitive stubs and improved signal integrity'20107,613,011'Signal-segregating connector system'20097,404,746'Electrical interconnection devices incorporating redundant contact points for reducing capacitive stubs and improved signal integrity'20087,388,279'Tapered dielectric and conductor structures and applications thereof'20087,347,697'Active connector'20087,278,855'High speed, direct path, stair-step, electronic connectors with improved signal integrity characteristics and methods for their manufacture'20077,227,759'Signal-segregating connector system'20077,192,320'Electrical interconnection devices incorporating redundant contact points for reducing capacitive stubs and improved signal integrity'20077,014,472'System for making high-speed connections to board-mounted modules'20065,505,625'Connector assembly for electrically interconnecting two printed circuit board like members'19965,496,182'Connector device for electrically interconnecting printed circuit board like members'19965,458,497'Connector assembly'19955,195,897'Connector and opening accessory'19935,044,980'High density and multiple insertion connector'19915,015,193'High density and high signal integrity connector'19914,911,643'High density and high signal integrity connector'19904,881,908'High density and high signal integrity connector'19894,360,865'Broad band microwave detector'1982Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1982–2012Based in Santa Clara, CA, US· patent location history
1989–1996Patents assigned to BETA PHASE INC (8)· patent assignee history
2007Patents assigned to SILICON PIPE INC (3)· patent assignee history
2008–2012Patents assigned to INTERCONNECT PORTFOLIO LLC (11)· patent assignee history
2011–2012Patents assigned to FJELSTAD JOSEPH C (2)· patent assignee history
2011–2012Patents assigned to GRUNDY KEVIN P (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTERCONNECT PORTFOLIO LLC | 11 | 2008–2012 |
| BETA PHASE INC | 8 | 1989–1996 |
| SILICON PIPE INC | 3 | 2007 |
| FJELSTAD JOSEPH C | 2 | 2011–2012 |
| GRUNDY KEVIN P | 2 | 2011–2012 |
Locations
| Location | Patents | Span |
|---|---|---|
| Santa Clara, California, US | 26 | 1982–2012 |