Inventor

Hsun-Wei Chan

Inventor

Kaohsiung, TW

Overview

19→

Patents

2014–2020

Patent span

Electricity

Primary field (CPC H)

Patents· 19 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1024%

H01LSemiconductor devices22%

H10HInorganic light-emitting semiconductor devices having potential barriers14%

H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation11%

B81BMicrostructural devices or systems, e.g. micromechanical devices6%

B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems5%

G01SRadio direction-finding3%

G02BOptical elements, systems or apparatus3%

G01CMeasuring distances, levels or bearings2%

G01JMeasurement of intensity, velocity, spectral content, polarisation, phase or pulse characteristics of infrared, visible or ultraviolet light2%

PatentTitleYear

10,862,014Optical device package and method of manufacturing the same2020 10,804,173Lid structure and semiconductor device package including the same2020 10,752,494Semiconductor device package2020 10,689,249Semiconductor device package including a wall and a grounding ring exposed from the wall2020 10,629,787Lid and an optical device package having the same2020 10,526,200Semiconductor device package including cover including tilted inner sidewall2020 10,508,910Optical module and method of making the same2019 10,453,760Lid array panel, package with lid and method of making the same2019 10,436,635Active optical component with passive optical component and encapsulant for an optical device and electrical device including the same2019 10,424,566Semiconductor package device and method of manufacturing the same2019 10,396,783Optical module, manufacturing method thereof and electronic apparatus2019 10,381,294Semiconductor package device2019 10,347,570Semiconductor package device2019 10,177,283LED packages and related methods2019 10,069,051Semiconductor package device and method of manufacturing the same2018 9,881,845'Electronic device, lid structure and package structure'2018 9,850,124Semiconductor device package for reducing parasitic light and method of manufacturing the same2017 9,653,656'LED packages and related methods'2017 8,637,887'Thermally enhanced semiconductor packages and related methods'2014

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2014–2020Patents assigned to ADVANCED SEMICONDUCTOR ENG (18)· patent assignee history

2014–2017Patents assigned to CHAN HSUN-WEI (2)· patent assignee history

2014–2019Based in Taoyuan, TW· patent location history

2017–2020Based in Kaohsiung, TW· patent location history

2020Patents assigned to ADVANCED SEMICONDUCTORY ENGINEERING INC (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
ADVANCED SEMICONDUCTOR ENG	18	2014–2020
CHAN HSUN-WEIself	2	2014–2017
ADVANCED SEMICONDUCTORY ENGINEERING INC	1	2020

Locations

Location	Patents	Span
Kaohsiung, TW	16	2017–2020
Taoyuan, TW	3	2014–2019