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Inventor

Pei Ee Chua

Inventor
Singapore, SG

Overview

1→
Patents
2014
Patent span
Performing operations
Primary field (CPC B)

Patents· 1 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B29Cprimary
B29CShaping or joining of plastics50%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
PatentTitleYear
8,852,986'Integrated circuit package system employing resilient member mold system technology'2014

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2014Patents assigned to CHOW SENG GUAN (1)· patent assignee history
2014Patents assigned to CHUA PEI EE (1)· patent assignee history
2014Patents assigned to KUAN HEAP HOE (1)· patent assignee history
2014Patents assigned to STATS CHIPPAC LTD (1)· patent assignee history
2014Based in Singapore, SG· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
CHOW SENG GUAN12014
CHUA PEI EEself12014
KUAN HEAP HOE12014
STATS CHIPPAC LTD12014
Locations
LocationPatentsSpan
Singapore, SG12014