Inventor
Mika Kiritani
Inventor
Kawasaki, JP
Overview
Patents· 8 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1025%
H10DInorganic electric semiconductor devices19%
B29CShaping or joining of plastics6%
PatentTitleYear
7,833,836'Stack MCP and manufacturing method thereof'20107,608,911'Semiconductor device package having a semiconductor element with a roughened surface'20097,482,695'Stack MCP and manufacturing method thereof'20097,405,159'Method of fabricating a semiconductor device package having a semiconductor element with a roughened surface'20087,285,864'Stack MCP'20077,202,563'Semiconductor device package having a semiconductor element with resin'20076,787,093'Semiconductor resin molding method'20046,777,313'Semiconductor device manufacturing method for reinforcing chip by use of seal member at pickup time'2004Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2004–2010Patents assigned to TOSHIBA KK (8)· patent assignee history
2004–2010Based in Kawasaki, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TOSHIBA KK | 8 | 2004–2010 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kawasaki, JP | 8 | 2004–2010 |