Inventor

SIRENA CHI LU

Inventor

Overview

4→

Patents

2022–2023

Patent span

Physics

Primary field (CPC G)

Patents· 4 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B33Yprimary

B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering11%

B41JTypewriters11%

G01FMeasuring volume, volume flow, mass flow or liquid level11%

G01LMeasuring force, stress, torque, work, mechanical power, mechanical efficiency, or fluid pressure11%

G03GElectrography11%

G05BControl or regulating systems in general11%

G06FElectric digital data processing11%

G06KGraphical data reading11%

H04LTransmission of digital information, e.g. telegraphic communication11%

PatentTitleYear

11,738,562Logic circuitry2023 11,479,046Logic circuitry for sensor data communications2022 11,427,010Logic circuitry2022 11,331,925Logic circuitry2022

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2022–2023Patents assigned to HEWLETT PACKARD DEVELOPMENT CO (4)· patent assignee history

2022–2023Based in US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
HEWLETT PACKARD DEVELOPMENT CO	4	2022–2023

Locations

Location	Patents	Span
US	4	2022–2023